schottky die 200 x 200 mils (monolithic dual) sc202.....5.. series bulletin i0508j rev. b 05/01 not to scale 40 (157) notes: 1. all dimensions are shown in millimeters (mils). 2. controlling dimension: (mils). 3. dimensions and tolerances: a = 5.08 + 0, - 0.01 (200 + 0, - 0.4) b = 5.08 + 0, - 0.01 (200 + 0, - 0.4) c = 4.92 + 0, - 0.01 (193 + 0, - 0.4) d = 2.43 + 0, - 0.01 (95 + 0, - 0.4) ? = 1 0.15 (40 6) 4. letter designation: a = anode (top metal) c = cathode (back metal) d = reject ink dot (only on non-conforming dies) 5. sawing: recommended blade semitec s1025 qs00 blade sawing street 0.05 + 0, - 0.005 (2 + 0, - 0.2) wafer flat alligned with side b of the die (10 0.4) b c anode a d anode 0.25 0.01 ? d www.vishay.com 1 document number: 93870
sc202.....5. series preliminary data sheet i0508j rev. b 05/01 sc202 s 020a5 150 20 8 0.42 v @ 40a per die, t j = 25c sc202 s 030a5 150 30 2 0.46v @ 30a per die, t j = 25c sc202 s 045a5 150 45 2 0.51 v @ 20a per die, t j = 25c sc202 s 060a5 150 60 2 0.54v @ 15a per die, t j = 25c sc202 h 100a5 150 100 0.55 0.69 v @ 10a per die, t j = 25c sc202....5 b . inked probed unsawn wafer (wafer in box) 48 device t j max. v r max. i r @ 25c (*) max. v f @ i f # (c) (v) (ma) (v) electrical characteristics device metal thickness metal thickness # front metal back metal sc202.... a 5.. bondable -- al/si 30 k? -- ti 1 k? ni 4 k? ag 6 k? mechanical data device description minimum order quantity # wafer in sale package packaging visual inspection : see ir internal spec. # 6373-2064 recommended storage environment: store in original container, in dessicated nitrogen, with no contamination. shelf life for parts stored in above condition is 2 years. if the storage is done in normal atmosphere shelf life is reduced to six months. (*) for reference only, v f do not include voltage drop across wire bonding resistance www.vishay.com 2 document number: 93870
sc202.....5. series preliminary data sheet i0508j rev. b 05/01 sc 202 s 060 a 5 b 1 2 3 1 - schottky die 2 - chip dimension in mils: 200 x 200 dual monolithic 3 - process (see electrical characteristics table) 4 - voltage code: code = v rrm 5 - chip surface metallization (al) 6 - wafer diameter in inches 7 - packaging: b = inked probed unsawn wafers (in box) 4 device code ordering information table 5 6 7 h = 830 process r = or' ing process s = standard process wafer in box round container foam disk tyvek disk www.vishay.com 3 document number: 93870
sc202.....5. series preliminary data sheet i0508j rev. b 05/01 world headquarters: 233 kansas st., el segundo, california 90245 u.s.a. tel: (310) 322 3331. fax: (310) 322 3332. european headquarters: hurst green, oxted, surrey rh8 9bb, u.k. tel: ++ 44 1883 732020. fax: ++ 44 1883 733408. ir canada: 15 lincoln court, brampton, markham, ontario l6t3z2. tel: (905) 453 2200. fax: (905) 475 8801. ir germany: saalburgstrasse 157, 61350 bad homburg. tel: ++ 49 6172 96590. fax: ++ 49 6172 965933. ir italy: via liguria 49, 10071 borgaro, torino. tel: ++ 39 11 4510111. fax: ++ 39 11 4510220. ir far east: k&h bldg., 2f, 30-4 nishi-ikebukuro 3-chome, toshima-ku, tokyo, japan 171. tel: 81 3 3983 0086. ir southeast asia: 1 kim seng promenade, great world city west tower,13-11, singapore 237994. tel: ++ 65 838 4630. ir taiwan: 16 fl. suite d.207, sec. 2, tun haw south road, taipei, 10673, taiwan. tel: 886 2 2377 9936. data and specifications subject to change without notice. www.vishay.com 4 document number: 93870
legal disclaimer notice vishay document number: 99901 www.vishay.com revision: 12-mar-07 1 notice the products described herein were acquired by vishay intertechnology, inc., as part of its acquisition of international rectifier?s power control systems (pcs) business, which closed in april 2007. specifications of the products displayed herein are pending review by vishay and are subject to the terms and conditions shown below. specifications of the products displayed herein are subject to change without notice. vishay intertechnology, inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. except as provided in vishay's terms and conditions of sale for such products, vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and /or use of vishay products including liab ility or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyrigh t, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify vishay for any damages resulting from such improper use or sale. international rectifier ? , ir ? , the ir logo, hexfet ? , hexsense ? , hexdip ? , dol ? , intero ? , and powirtrain ? are registered trademarks of international rectifier corporation in the u.s. and other countries. all other product names noted herein may be trademarks of their respective owners.
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